Tantalum sputtering target

Tantalum sputtering targets are used in the sputtering process to deposit thin films of tantalum onto a substrate. The sputtering process is a type of physical vapor deposition (PVD) process used to deposit thin films of various materials onto a substrate. The sputtering process involves bombarding a target material with energetic ions, which causes atoms of the target material to be ejected from the target. These atoms then travel through the vacuum chamber, and are deposited onto the substrate, forming a thin film. Tantalum has a wide range of applications in the electronics industry, and is often used to create thin films of tantalum nitride, which is used for wear resistance, corrosion resistance, and electrical insulation. Tantalum sputtering targets are available in a variety of sizes, shapes, and purity levels, and can be used to deposit thin films of tantalum onto a variety ofdifferent substrates.

Export of tantalum sputtering targets for scientific research at the Technical University of Munich

99.95% Ta evaporation material sputtering target
High Purity Tantalum Target
Level: Ta 1 Ta 2
Density: 16.6 g/cm3
Purity: 99.95%min
Standard: ASTM B365
Melting point: 2996 degrees Celsius
Boiling point: 5425 degrees Celsius
Color: silver gray
State: vacuum annealed
Surface: Alkaline washed/polished surface
Processing technology: stamping / machining

Tantalum applications:
 
1) In the production of various inorganic acids, tantalum is used instead of stainless steel, and the service life of tantalum devices is many times that of stainless steel devices.

2) In the chemical industry, electronics, electrical appliances and other industries, the cost is greatly reduced by using tantalum instead of precious metal platinum.

3) Tantalum is an important alloying element for smelting super steel, corrosion-resistant steel and heat-resistant steel.
 
4) Tantalum is used in modern medicine. Tantalum is harmless to the human body, and human muscles can grow on tantalum.