Molybdenum Sputtering Target
Molybdenum sputtering target is a material used in the physical vapor deposition (PVD) process, especially in sputtering coating technology. This target is made of pure molybdenum (Mo) or its alloy and is used to deposit a thin molybdenum film on a substrate.
1. Purpose: Molybdenum film is commonly used in electronic devices, semiconductor manufacturing, optical components, decorative coatings, wear-resistant coatings and high-temperature applications due to its good electrical conductivity, high melting point and anti-corrosion properties.
2. Production: Molybdenum sputtering targets are usually prepared by powder metallurgy technology, which involves pressing molybdenum powder into shape and then sintering to obtain the required density and strength. In some cases, hot rolling or other processing steps may also be performed to improve the performance of the target.
3. Purity: Depending on application requirements, molybdenum targets can have different purity levels. High-purity targets are suitable for applications that require extremely high film quality, such as semiconductor manufacturing.
4. Shape: Molybdenum sputtering targets can be made into flat, round or other customized shapes to suit different sputtering systems and equipment configurations.
5. Installation: During the sputtering process, the molybdenum target is installed on the cathode in the sputtering chamber, and attracts positive ions in the plasma through a strong electric field. These ions bombard the target surface, causing the target atoms to be sputtered out and deposited on the opposite substrate to form a thin film.
6. Performance: The characteristics of the molybdenum film, such as thickness, uniformity, structure and surface smoothness, depend on the parameters of the sputtering process, including air pressure, power supply, distance between the target and the substrate, and sputtering time.
7. Note: Since molybdenum is easily oxidized when the temperature exceeds 500°C in the air, it is necessary to maintain a vacuum or use protective gas during the sputtering process to prevent oxidation of the film material.
2. Production: Molybdenum sputtering targets are usually prepared by powder metallurgy technology, which involves pressing molybdenum powder into shape and then sintering to obtain the required density and strength. In some cases, hot rolling or other processing steps may also be performed to improve the performance of the target.
3. Purity: Depending on application requirements, molybdenum targets can have different purity levels. High-purity targets are suitable for applications that require extremely high film quality, such as semiconductor manufacturing.
4. Shape: Molybdenum sputtering targets can be made into flat, round or other customized shapes to suit different sputtering systems and equipment configurations.
5. Installation: During the sputtering process, the molybdenum target is installed on the cathode in the sputtering chamber, and attracts positive ions in the plasma through a strong electric field. These ions bombard the target surface, causing the target atoms to be sputtered out and deposited on the opposite substrate to form a thin film.
6. Performance: The characteristics of the molybdenum film, such as thickness, uniformity, structure and surface smoothness, depend on the parameters of the sputtering process, including air pressure, power supply, distance between the target and the substrate, and sputtering time.
7. Note: Since molybdenum is easily oxidized when the temperature exceeds 500°C in the air, it is necessary to maintain a vacuum or use protective gas during the sputtering process to prevent oxidation of the film material.